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Figure 1: Heat moves from the junction to the surrounding environment through various means. From the junction to the heat sink, the transfer of heat occurs by conduction, while from the heat sink to the surrounding environment, it occurs by convection. The various components of the system behave just like electrical resistances, through which it is not the current that encounters an obstacle in the passage but the heat. By radiation, with electromagnetic wavesįigure 1 clearly summarizes the heat transfer process.By convection, by means of a fluid such as air or water.The main ones are “ZVS soft-switching mode” and “hard-switching mode.” Heat transfer occurs in three different ways: The implementation of different switching methods inevitably implies differences in design and, above all, in final performance. Choosing a good substrate certainly contributes to better heat dissipation by making it possible to reduce the radiator surface, especially for power applications. Good thermal design also positively affects the variation in power density. To increase the reliability of the circuit.To increase system performance and efficiency.To prevent thermal runaway in the worst operating conditions.
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